| Scope | 1.25 Ultra-thin Series Connector | |
| Appearance | Product surface without defect, dirt, crack, and mechanical damage; contact without rust, plating not oxidized and not peeled. | |
| Dimension | According to drawings | |
| Material & Surface Treatment | Terminal | Phosphor bronze, 0.15mm thick; Tin Plating: 2.5-5m |
| Housing | PBT, UL94V-0, Color: White |
| Wafer | PA9T, UL94V-0, Color: Beige |
| Contact | Phosphor bronze, 0.30mm thick; Gold Plating: 0.5~1 |
| Ratings & Applicable Wires | Rated Voltage | 125V AC/DC |
| Rated Current | 1A AC/DC |
| Ambient Temperature Range | -25 to +85 |
| Applicable Wire Gauge | AWG28#-32# |
| Electrical Performance | Contact Resistance | Initial: 20m; After Test: 30m |
| Withstand Voltage | 500V AC for 1 minute (between adjacent terminals or ground) - No Breakdown/Flashover |
| Insulation Resistance | 100M (at 500V DC between adjacent terminals or ground) |
| Mechanical Performance | Terminal Crimping Wire Strength | AWG#28: 13N; AWG#30: 8N; AWG#32: 6N |
| Terminal/Housing Retention Force | 8N per contact |
| Insertion & Withdrawal Force | Refer to Section 8 |
| Pin Retention Force | 2N per contact |
| Endurance Characteristics | Repeated Insertion/Withdrawal | 30 cycles; Contact Resistance: 30 m Max |
| Temperature Rise | 30 Max (at rated current until thermal stability) |
| Vibration Test | Amplitude: 1.5mm P-P; Frequency: 10-55-10 Hz; Duration: 2 hours per axis (X,Y,Z); Contact Resistance: 30 m Max; Discontinuity: 1 micro-second Max |
| Heat Resistance | 852, 96 hours; Contact Resistance: 30 m Max |
| Cold Resistance | -253, 96 hours; Contact Resistance: 30 m Max |
| Humidity | 602, 90~95% RH, 96 hours; Contact Resistance: 30 m Max; Withstand Voltage: No Breakdown/Flashover; Insulation Resistance: 100M Min |
| Temperature Cycling | 5 cycles (-25 for 30 min to +85 for 30 min); Contact Resistance: 30 m Max |
| Salt Spray | 352, 51% solution, 241 hours; Contact Resistance: 30 m Max |
| Solderability | Soldering Time: 3-5 sec; Temp: 2455; Solder Wetting: 95% immersion area |
| Solder-Resistance | SMT reflow; Soldering time: 5-10 sec; Temp: 2555 (Refer to 9.1) |
| Insertion/Withdrawal Force | Refer to Section 8 for details based on PIN count. | |
| SMT Process | Lead-free process temperature curve | Refer to Section 9.1. Note: Check reflow soldering conditions with own devices. |
| Caution | Plastic absorbs moisture. Avoid exposure to temperatures > 30, humidity > 60%RH after opening package. Use within 24 hours to prevent foaming/deformation during reflow/wave soldering. | |
